| 摘要 |
PROBLEM TO BE SOLVED: To enable a void shape analysis to be applied to the reserve part of a (W) plug-attached Al alloy wiring, based on current heat transfer analysis and diffusion analysis of atoms in a crystal grain structure, in an analysis method of wiring faults accompanied with a form change in a wiring. SOLUTION: A wiring structure is formed, a background (temperature, current density) is solved by a finite element method, and a diffusion analysis is carried out by the use of an electron wind power proportional to a current density and diffusion coefficients (lattice, grain boundary, interface, surface) related to crystal structures, to obtain void density. When void density exceeds a certain critical value at grain boundaries and interfaces, fine voids are generated tentatively around nodes, a chemical potential is calculated before and behind them, and voids are generated at a node varying least in a chemical potential.
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