| 摘要 |
<p>A method of mounting electronic parts capable of efficiently and surely mounting surface mounting parts and ICs on one substrate, comprising the steps of feeding a hot solder paste (4) to electrodes (2) for mounting surface mounting parts, mounting the surface mounting parts (40) on the electrodes (2) and temporarily fixing with the hot solder paste (4), applying a flux (5) onto an electrode (1) where an IC with eutectic solder bump (30a) must be mounted or applying the flux (5) onto an eutectic solder bump (31), mounting the IC (30a) on the electrode (1) and temporarily fixing with the flux (5), and heating a wiring board (10) in a hot atmosphere where hot solder and eutectic solder are molten so as to reflow-solder the surface mounting parts (40) and ICs (30a).</p> |
