DIE FOR SEMICONDUCTOR PACKAGE,申请号KR20000032219-传众专利搜索

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发明名称	DIE FOR SEMICONDUCTOR PACKAGE
摘要
申请公布号	KR20010111663(A)	申请公布日期	2001.12.20
申请号	KR20000032219	申请日期	2000.06.12
申请人	AMKOR TECHNOLOGY KOREA, INC.	发明人	LEE, YEONG U
分类号	(IPC1-7):H01L21/56	主分类号	(IPC1-7):H01L21/56
代理机构		代理人
主权项
地址

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