| 摘要 |
The invention relates to a semiconductor device (10) comprising an IC (1) which is attached to one side of an insulating substrate (11) which, on said side, is provided with a first conductor pattern (12) to which the connection conductors (4) of the IC (1) are connected and which is electrically connected to a second conductor pattern (13) present on the other side of the substrate (11) and provided with contact bumps (5). A device (10) according to the invention is provided with one or more fuses (6) and with an electrical component (7), a property of which can be adjusted by means of the fuses (6), which component (7) forms part of the IC (1), and the fuses (6) form part of the conductor patterns (12, 13) on the insulating substrate (11). Such a device is very compact and its manufacture is easy and inexpensive. There is no need to supply the end user with any information regarding the calibration of the device (10). The fuses (6) preferably are conductor tracks (6) comprising constrictions, and they are preferably positioned between the contact bumps (5) present in the form of a matrix. The substrate (11) preferably is a foil (11).
|
