发明名称 Semiconductor device, method of manufacturing the same and resistor
摘要 Formed on an insulator (9) are an N- type semiconductor layer (10) having a partial isolator formed on its surface and a P- type semiconductor layer (20) having a partial isolator formed on its surface. Source/drain (11, 12) being P+ type semiconductor layers are provided on the semiconductor layer (10) to form a PMOS transistor (1). Source/drain (21, 22) being N+ type semiconductor layers are provided on the semiconductor layer (20) to form an NMOS transistor (2). A pn junction (J5) formed by the semiconductor layers (10, 20) is provided in a CMOS transistor (100) made up of the transistors (1, 2). The pn junction (J5) is positioned separately from the partial isolators (41, 42), where the crystal defect is thus very small. Therefore, the leakage current is very low at the pn junction (J5).
申请公布号 US2001052620(A1) 申请公布日期 2001.12.20
申请号 US20010814116 申请日期 2001.03.22
申请人 发明人 IPPOSHI TAKASHI;IWAMATSU TOSHIAKI
分类号 H01L21/76;H01L21/761;H01L21/762;H01L21/822;H01L21/84;H01L27/04;H01L27/08;H01L27/12;H01L29/786;H01L29/861;(IPC1-7):H01L27/01;H01L31/039 主分类号 H01L21/76
代理机构 代理人
主权项
地址