发明名称 |
POWER MODULE PACKAGE WITH INSULATING HEAT SINK |
摘要 |
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic. |
申请公布号 |
KR20010111736(A) |
申请公布日期 |
2001.12.20 |
申请号 |
KR20000032383 |
申请日期 |
2000.06.13 |
申请人 |
FAIRCHILD KOREA SEMICONDUCTOR LTD. |
发明人 |
JUN, GI YEONG;KIM, BYEONG GON;LEE, EUN HO;LIM, EUL BIN |
分类号 |
H01L23/433;H01L23/495 |
主分类号 |
H01L23/433 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|