发明名称 POWER MODULE PACKAGE WITH INSULATING HEAT SINK
摘要 A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
申请公布号 KR20010111736(A) 申请公布日期 2001.12.20
申请号 KR20000032383 申请日期 2000.06.13
申请人 FAIRCHILD KOREA SEMICONDUCTOR LTD. 发明人 JUN, GI YEONG;KIM, BYEONG GON;LEE, EUN HO;LIM, EUL BIN
分类号 H01L23/433;H01L23/495 主分类号 H01L23/433
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