Mounting chips using flip-chip technology by subjecting wafer to pressure and heat to melt bumps and attach wafer

摘要

The method involves providing protrusions on the upper side of a wafer (20) and applying solder bumps (24) to the substrate (22) by printing or electroplating. A filler (23) is applied to the substrate. The wafer is turned over and placed on the substrate, so that the projections are in direct contact with the bumps. The wafer is subjected to pressure and heat to melt the bumps and attach the wafer firmly to the substrate upon cooling.