发明名称 A METHOD OF AND APPARATUS FOR MONITORING A BALL FORMING PROCESS
摘要 A method of monitoring a ball forming process in a wire bonder. A glow discharge parameter between an electrode on the wire bonder and an end of a wire mounted on the wire bonder on which the ball is being formed is monitored. The monitored parameter is compared with a reference value to determine whether the ball formed is satisfactory.
申请公布号 WO0197256(A2) 申请公布日期 2001.12.20
申请号 WO2000SG00087 申请日期 2000.06.13
申请人 ASM TECHNOLOGY SINGAPORE PTE LTD.;BOLLER, MICHAEL, ARMIN;WONG, YAM, MO;ANNAMALAI, BASKARAN;ZHU, HONGHAI 发明人 BOLLER, MICHAEL, ARMIN;WONG, YAM, MO;ANNAMALAI, BASKARAN;ZHU, HONGHAI
分类号 H01L21/00 主分类号 H01L21/00
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