发明名称 Process for forming photoresist pattern by using gas phase amine treatment
摘要 The present invention provides a process for producing a photoresist pattern. In particular, the present invention provides a process for forming a photoresist pattern which reduces or prevents poor quality photoresist patterns formation, especially when a high light absorbing (i.e., low transmittance) photoresist resin is used. In one aspect of the present invention, a photoresist film which has been exposed to light is treated with a gas phase basic compound to produce a substantially vertical photoresist pattern.
申请公布号 US2001053590(A1) 申请公布日期 2001.12.20
申请号 US20010852377 申请日期 2001.05.10
申请人 JUNG JAE CHANG;KOH CHA WON;KIM JIN SOO;HONG SUNG EUN;KONG KEUN KYU;BAIK KI HO 发明人 JUNG JAE CHANG;KOH CHA WON;KIM JIN SOO;HONG SUNG EUN;KONG KEUN KYU;BAIK KI HO
分类号 G03F7/36;(IPC1-7):H01L21/20 主分类号 G03F7/36
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