发明名称 |
Process for forming photoresist pattern by using gas phase amine treatment |
摘要 |
The present invention provides a process for producing a photoresist pattern. In particular, the present invention provides a process for forming a photoresist pattern which reduces or prevents poor quality photoresist patterns formation, especially when a high light absorbing (i.e., low transmittance) photoresist resin is used. In one aspect of the present invention, a photoresist film which has been exposed to light is treated with a gas phase basic compound to produce a substantially vertical photoresist pattern.
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申请公布号 |
US2001053590(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
US20010852377 |
申请日期 |
2001.05.10 |
申请人 |
JUNG JAE CHANG;KOH CHA WON;KIM JIN SOO;HONG SUNG EUN;KONG KEUN KYU;BAIK KI HO |
发明人 |
JUNG JAE CHANG;KOH CHA WON;KIM JIN SOO;HONG SUNG EUN;KONG KEUN KYU;BAIK KI HO |
分类号 |
G03F7/36;(IPC1-7):H01L21/20 |
主分类号 |
G03F7/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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