发明名称 |
Thermosetting resin composition |
摘要 |
A semiconductor device includes a circuit substrate having the metallic bumps electrically connected through lands on both the front side of the substrate where the semiconductor elements are to be mounted and the opposite side thereof. The semiconductor elements are connected to the metallic bumps on the front side of the substrate and a thermosetting resin composition containing a spherical filler is disposed between the semiconductor elements and the substrate.
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申请公布号 |
US2001053448(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
US20010810467 |
申请日期 |
2001.03.19 |
申请人 |
SATSU YUICHI;NAKAI HARUKAZU;TAKAHASHI AKIO;SUZUKI MASAO;SUGAWARA KATSUO |
发明人 |
SATSU YUICHI;NAKAI HARUKAZU;TAKAHASHI AKIO;SUZUKI MASAO;SUGAWARA KATSUO |
分类号 |
H05K1/03;C08G59/14;C08K5/54;C08L63/00;C08L83/06;C08L101/00;H01L23/29;H01L23/31;(IPC1-7):B32B9/04 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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