ELECTRONIC PARTS PACKAGING METHOD AND ELECTRONIC PARTS PACKAGE

摘要

An electronic parts packaging method comprising the step of joining an electronic part (1-1) to a circuit forming body (6-1) through a joining material (5) containing resin, wherein with bumps (2) in an electronic parts joining region (6a-1) being in electric contact with electrodes (7) in the circuit forming body, thermo-compression bonding is effected to allow the joining material to harden while controlling the flow of the joining material to the peripheral portion of an electronic parts joining region by means of a joining material flow control member (303) associated with the electronic parts joining region.