| 摘要 |
<p>A multi-layer printed circuit board is disclosed which comprises at least two layers (1) of substrate sandwiching a conductive track. A terminal receiving through hole (2) extends through the layers to receive a conductive terminal, such as the leg of a resistor or lead frame. A conductive link (3) is provided adjacent the terminal receiving hole (2) and extends from at least one surface of the board to the track (1). A conductive path (4) provided on the surface provides an electrical connection between the terminal (2) and the link (3), eliminating the need for electrical connection between the terminal (2) and the track (1) at an internal layer.</p> |
