发明名称 |
SEMICONDUCTOR PACKAGE WITH AN ELECTRICAL STATIC DISCHARGE RESISTOR |
摘要 |
A package with an electrical static discharge resistor. A chip is attached on a carrier with bumps and contacts. The carrier couples with the chip through the bumps. Electrical static discharge resistors between the bumps and the contacts are on the carrier.
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申请公布号 |
US2001052632(A1) |
申请公布日期 |
2001.12.20 |
申请号 |
US19990392275 |
申请日期 |
1999.09.09 |
申请人 |
WU TSUNG-CHIH;YANG TE-SHENG |
发明人 |
WU TSUNG-CHIH;YANG TE-SHENG |
分类号 |
H01L23/60;(IPC1-7):H01L29/00 |
主分类号 |
H01L23/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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