发明名称 A METHOD AND APPARATUS FOR CONDITIONING ELECTROCHEMICAL BATHS IN PLATING TECHNOLOGY
摘要 <p>An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition. The constituents may be added at the beginning of the use of the bath to initially condition the electrochemical bath or may be added, preferably either continuously or periodically, during the electrochemical deposition process.</p>
申请公布号 WO2001096632(A2) 申请公布日期 2001.12.20
申请号 US2001018211 申请日期 2001.06.06
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址