| 摘要 |
A solid image pickup device is enclosed in an integral package comprising an upper package and a lower package, which are made of a resin and molded together with a lead frame held between the upper and lower packages, the device having outline references provided on lateral sides of the integral package. Tapered surfaces are formed along an overall side periphery of the upper package and an overall side periphery of the lower package. A plurality of holes are formed to penetrate the integral package in the vertical direction. Cutouts are formed on opposite lateral sides of the integral package to make parts of two parallel sides of the lead frame exposed to the outside, and the holes are formed in the parts of the lead frame exposed in the cutouts.
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