PRESSURE SENSITIVE ADHESIVE HAVING HIGH HEAT RESISTANCE AND LOW COMPLEX VISCOSITY
摘要
The present invention is a hot melt pressure sensitive adhesive composition having high heat resistance and a relatively low complex viscosity, methods of use and articles constructed therefrom. The novel adhesive composition is suitable for a variety of high performance pressure sensitive adhesive applications.
申请公布号
WO0196491(A1)
申请公布日期
2001.12.20
申请号
WO2001US18525
申请日期
2001.06.07
申请人
H.B. FULLER LICENSING & FINANCING, INC.;LINDQUIST, JEFFREY, S.;SIMMONS, EUGENE, R.
