发明名称 |
FLAME RETARDANT EPOXY RESIN COMPOSITION FOR PRINTED BOARD, AND PREPREG AND METAL FOIL CLAD LAMINATE USING THE SAME |
摘要 |
<p>A flame retardant epoxy resin composition which can improve heat resistance and exhibit an excellent adhesion strength and insulation reliability when applied to a printed circuit board or to a multilayered interconnection laminate is provided, and a prepreg and a metal foil clad laminate using the same composition are manufactured. This flame retardant epoxy resin composition consists of: (a) an epoxy resin containing a glicidylether compound which is a condensate of bisphenol A or bisphenol F with formaldehyde; (b) a condensate of bisphenol A with formaldehyde; (c) haloganated bisphenol A as a flame retardant agent; and (d) a hardening accelerator, wherein the haloganated bisphenol A is contained in 45 weight % or less of a total solid resin weight. A metal foil clad laminate is provided using this composition as a varnish, impregnating the same into a base material to obtain the prepreg, laminating the prepreg, depositing a metal foil on one or both surfaces thereof, and heating under pressure.</p> |
申请公布号 |
SG85102(A1) |
申请公布日期 |
2001.12.19 |
申请号 |
SG19990000181 |
申请日期 |
1999.01.26 |
申请人 |
HITACHI CHEMICAL COMPANY LTD |
发明人 |
NOZOMU TAKANO;MICHITOSHI ARATA;HIKARI MURAI;YOSHIYUKI TAKEDA |
分类号 |
C08J5/24;B32B15/08;B32B15/092;C08G59/08;C08G59/32;C08G59/62;C08L63/04;H05K1/03;(IPC1-7):C08G59/08 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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