ELECTRONIC SYSTEM CIRCUIT PACKAGE

摘要

An electronic system circuit package is disclosed herein. The package utilizes a lead frame having an electrically conductive component support segment incorporating provisions for mounting a plurality of electronic components directly on the support segment in accordance with a predetermined circuit design. The circuit package is then encapsulated in a dielectric medium. In a preferred embodiment, at least some of the electronic components are mounted directly to electrically isolated subsegments of the component support segment and electrically interconnected through their respective subsegments to other components.