发明名称 |
LÖT-ANSCHLUSSKONTAKT UND VERFAHREN ZU SEINER HERSTELLUNG |
摘要 |
An process and a structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask. <MATH> |
申请公布号 |
AT209397(T) |
申请公布日期 |
2001.12.15 |
申请号 |
AT19950480062T |
申请日期 |
1995.05.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ATKINSON NYE , HENRI, III;ROEDER, JEFFREY FREDERICK;TONG, HO-MING;TOTTA, PAUL ANTHONY |
分类号 |
H05K3/34;H01L21/60;H01L23/485 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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