| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which has a terminal capable of holding the junction strength without fail, without causing interface breakage even in long-term use under severe harsh atmospheric conditions where high temperature and low temperature are repeated, and to provide a junction structure for the terminal part of such a circuit board. SOLUTION: When a gold plated layer 7b is formed at the terminal 6 of a circuit board 1, or when a gold plated layer is formed as an outside terminal 5 for an external circuit, a solder bump 8 which includes at least any one of tin, silver or copper is formed at the terminal 6. |
