发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR PRODUCING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of manufacturing a semiconductor device at a low cost with good step coverage. SOLUTION: Using an apparatus having one reaction chamber 4 which can contain a substrate 1, a port 5 for supplying the reaction chamber 4 with a material gas for forming a ruthenium film or a ruthenium oxide film on the substrate 1, and a port 6 for discharging the material gas from the reaction chamber 4, a material gas is fed from the gas supply port 5 toward the substrate 1 and a ruthenium film or a ruthenium oxide film is formed on the substrate 1 by thermal CVD. Subsequently, the ruthenium film or the ruthenium oxide film is used as an underlying layer for forming a thicker ruthenium film or a ruthenium oxide film by thermal CVD under different filming conditions.
申请公布号 JP2001345285(A) 申请公布日期 2001.12.14
申请号 JP20010024360 申请日期 2001.01.31
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ITAYA HIDEJI;KYODA MASAYUKI
分类号 H01L21/20;C23C16/18;C23C16/40;H01L21/02;H01L21/28;H01L21/285;H01L21/8242;H01L27/108 主分类号 H01L21/20
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