发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR PRODUCING SEMICONDUCTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of manufacturing a semiconductor device at a low cost with good step coverage. SOLUTION: Using an apparatus having one reaction chamber 4 which can contain a substrate 1, a port 5 for supplying the reaction chamber 4 with a material gas for forming a ruthenium film or a ruthenium oxide film on the substrate 1, and a port 6 for discharging the material gas from the reaction chamber 4, a material gas is fed from the gas supply port 5 toward the substrate 1 and a ruthenium film or a ruthenium oxide film is formed on the substrate 1 by thermal CVD. Subsequently, the ruthenium film or the ruthenium oxide film is used as an underlying layer for forming a thicker ruthenium film or a ruthenium oxide film by thermal CVD under different filming conditions. |
申请公布号 |
JP2001345285(A) |
申请公布日期 |
2001.12.14 |
申请号 |
JP20010024360 |
申请日期 |
2001.01.31 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
ITAYA HIDEJI;KYODA MASAYUKI |
分类号 |
H01L21/20;C23C16/18;C23C16/40;H01L21/02;H01L21/28;H01L21/285;H01L21/8242;H01L27/108 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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