| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and method capable of effectively laying out elements of an integrated circuit. SOLUTION: This embodiment has an integrated circuit containing a plurality of I/O modules. The I/O module has a bond pad formed on a substrate. The I/O module has a static charge discharging device formed in the substrate. The static charge discharging device is at least partially formed under the bond pad. The I/O module has an I/O buffer formed in the substrate. The I/O buffer is connected to the bond pad. A communication between the bond pad and a circuit formed in the substrate can be obtained by the I/O buffer. The circuit is laid out substantially adjacent both the static charge discharging device and the I/O buffer.
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