| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing slurry, especially a slurry for reducing the surface roughness of a metallic base material. SOLUTION: The slurry contains polishing particles of silica, alumina, ceria, zirconia, titania or the like having an average particle size of <= about 5μm and an oxidizing agent of one or more kinds out of HNO3, Ni(NO3)2, Al(NO3)3, Mg(NO3)2, Zn(NO3)2 and NH4NO3 in an amount of >= about 0.5 wt.% in terms of the total. A small and effective amount of a supplementary oxidant of perbromate, perchlorate, periodate, persulfate, permanganate, ferric nitrate, a cerium-containing salt, perbenzoic acid, a nitrite compound, a perborate compound, a hypochlorite compound, a chlorite compound or a chloride compound stimulates the removal of the base material. Water constitutes the rest of the aqueous slurry.</p> |
