| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip package structure having a simpler configuration and manufactured at a lower cost as compared with a conventional technology. SOLUTION: Conductive resin bumps 24 are formed on the electrodes of a circuit board 2 by use of a metal mask 6 of a predetermined thickness, a conductive resin 7 and a squeegee 8, and then a semiconductor chip 1 is mounted on the circuit board 2 with the electrodes of the chip 1 aligned with the conductive resin bumps 24. Then, the semiconductor chip 1 is brought to the circuit board 2 by a predetermined distance on the basis of the position where the electrodes of the semiconductor chip 1 first contact the resin bumps 24 to surely put the electrodes of the semiconductor chip 1 into contact with the resin bumps 24, and finally the conductive resin is heated and cured. In this manner, the electrodes is surely connected to the bumps 24 and the circuit board 2 is bonded to the semiconductor chip 1.
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