发明名称 FLOOR MATERIAL FOR HEATING FLOOR
摘要 PROBLEM TO BE SOLVED: To improve thermal conductivity between a hot water pipe and a floor material and to increase the elevation speed of a floor surface temperature and thermal efficiency, in the floor material for a heating floor. SOLUTION: In the floor material A1 used in a hot water type heating floor, a recessed groove 20 for insertion of a hot water pipe having both depth and a groove width increased to a value larger than the diameter of a hot water pipe P being inserted is formed in a serpentine state in the back of the floor material.
申请公布号 JP2001343134(A) 申请公布日期 2001.12.14
申请号 JP20000162646 申请日期 2000.05.31
申请人 EIDAI CO LTD 发明人 INOUE TAKAO;YAMADA KAZUHIRO
分类号 E04F15/18;F24D3/16;(IPC1-7):F24D3/16 主分类号 E04F15/18
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