发明名称 WIRING BOARD AND ELECTRONIC COMPONENT USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To prevent wire breaking between a through conductor, which electrically connects the wiring conductor layers of a wiring board with each other, and the wiring conductor layer. SOLUTION: This is a wiring board 6 which comprises an insulating substrate 1, a plurality of insulating layers 2 formed on the insulating substrate 1, wiring conductor layers 3 formed on each surface of the insulating substrate 1 and the plural insulating layers 2, and a through-hole 5 constituted of a conductor filled in the through-hole 4 bored from each surface of the plural insulating layer 2 to the rear and electrically connecting the wiring conductor layers 3 with one another. A stacked through- conductor part 10 is formed by arranging the conductor filled in the through-hole 4 of each insulating layer 2 in vertical direction, and also embedding the end on the rear side of the insulating layer 2 of each conductor to a depth of one-tenth to half the thickness of the wiring conductor layer in the wiring conductor layer 3 on the rear side of the insulating layer 2 on each conductor. This board can be made into a wiring board, which is high in reliability for connection without the occurrence of wire breaking, since the end on the rear side of the insulating layer 2 on each conductor is embedded in the wiring conductor layer 3 on the rear side of each insulating layer 2.</p>
申请公布号 JP2001345557(A) 申请公布日期 2001.12.14
申请号 JP20000161385 申请日期 2000.05.31
申请人 KYOCERA CORP 发明人 WAKASAKI AKIRA;KIRIKIHIRA ISAMU
分类号 H05K1/11;H01L21/60;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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