| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a transfer substrate having a release layer such that the release layer does not peel in the succeeding processes after the release layer is formed. SOLUTION: The method includes a process of applying a coating type insulating film on an insulating substrate to cover the side faces of the insulating substrate, a process of decreasing the film thickness of the coating film formed on the side face of the insulating substrate, a process of heating and hardening the coating film to form a release film layer, a process of forming a transparent conductive layer on the release layer and a process of forming an adhesive layer on the transparent conductive layer. |
