THIN FILM ELECTRONIC PART, LAMINATED THIN FILM ELECTRONIC PART, AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a thin film electronic part which is capable of allowing its electrical connections to be easily ascertained after it is mounted on a mother board and reducing stress caused when mounted. SOLUTION: A thin film electronic part is equipped with a support substrate 1, a thin film element A with an insulating layer 3 and electrode layers 5 and 7, and outer terminals 11a and 11b electrically connected to the electrode layers 5 and 7, where through-holes 31a and 31b are bored in the support substrate 1, and conductors 32a and 32b filling up the through-holes 31a and 31b are electrically connected with the outer terminals 11a and 11b.