| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of an inefficient heat radiation from a semiconductor chip. SOLUTION: A multilayer substrate 3 is provided with ground conductors 30a and 30b which are connected electrically to a semiconductor element 2, an irregular part 27 formed at the upper part outside the mounting range of the semiconductor 2, and metals for heat radiation 34a and 34b, which formed on the surface of the irregular part 27 and connected electrically to the ground conductors 30a and 30b. |
