| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayered wiring board which can improve the productivity. SOLUTION: A multilayered wiring board is manufactured, by the process of forming a plurality of projections 2 of trapezoid cross section on the top of a substrate 1, a process of forming a first wiring layer 3 whose one part is arranged on the projections 2 on the substrate 1 by the printing and baking of conductive paste, the process of forming an insulating layer 4 where a through-hole 6 is provided on the projection 2 on the substrate 1 by the printing and baking of glass paste, and the process of forming the second wiring layer 5, whose one part is arranged on the above projection 2 and which is electrically connected with the first wiring layer 3 within the through-hole 6 on the above insulating layer 4 by the printing and baking of the conductive paste. |
