| 摘要 |
PROBLEM TO BE SOLVED: To improve radiation efficiency by appropriately conducting the heat of electronic components to a heat sink. SOLUTION: A heat conductive material 10 is composed of a heat conductive base 11, mesh copper foil 12, and peeling paper 13. The mesh copper foil 12 is formed in a mesh shape having a number of holes (meshes), and upper and lower heat conductive bases 11 continue through the meshes. In the heat conductive material 10, the mesh copper foil 12 is inserted between the electronic component and heat sink for use while the mesh copper foil 12 is being placed along the surface of the electronic component, the heat conductive base 11 is changed into plastic for adhering onto the surface of the electronic component and heat sink if heating is made after inserting, or the heat conductive base 11 is heated by the heat of the electronic component, thus improving heat- conducting efficiency via the heat conduction base 11, and hence appropriately radiating the heat of the electronic component.
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