发明名称 BOARD CARRIAGE MECHANISM IN REFLOW-SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a board carriage mechanism in a reflow-soldering device which can carry a board, to be carried smoothly into a furnace while preventing warpage. SOLUTION: This board carriage mechanism is equipped with an endless carriage means 12d on the fixing side, which is arranged on one side in the sending direction within the device body 11 for carrying a board P to be carried, and an endless carriage means 22 on the mobile side which is arranged on the other side. An endless carriage means 22 for bottom support of a board, which is equipped with projections 38, erected individually at specified intervals in the sending direction for supporting the bottom of the placed board P to be carried, is arranged freely of traveling in synchronization with the endless carriage means 12 on fixing side and the endless carriage means 22 on the mobile side and adjustment of height of the section on the side of an outward motion.
申请公布号 JP2001345551(A) 申请公布日期 2001.12.14
申请号 JP20000165762 申请日期 2000.06.02
申请人 NIPPON ANTOMU KOGYO KK 发明人 OKAMOTO TOYOO
分类号 B65G21/22;B65G23/44;H05K3/34;(IPC1-7):H05K3/34 主分类号 B65G21/22
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