| 摘要 |
PROBLEM TO BE SOLVED: To ensure reliability by increasing bonding strength with respect to the substrate of a relatively large electronic component, and to provide a wiring board mounted with an electronic component, having increased bonding density with respect to the wiring board. SOLUTION: Electrode pads 5, having nearly the same size and shape as those of terminal electrodes 4 located at the bottom face of a rectangular electronic component 2, are provided on the wiring board 1. Extended electrode pads 6 are formed from electrode pads which are disposed at each corner of the electronic component 2 or nearby. A solder fillet is formed on respective end face near each corner of the electronic component 2.
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