发明名称 SEMICONDUCTOR DEVICE PROVIDED WITH BUILT-IN ELECTROSTATIC PROTECTIVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a built-in electrostatic protective circuit which can avoid a current which passes through a silicide layer to concentrate on a hot spot. SOLUTION: A semiconductor device is constiututed in a structure that a salicide N-MOS transistor 110 isolated from other MOS transistor in a first diffused region is provided on a semiconductor substrate 100. A drain of the transistor 110 is separated from the transistor 110 by a second element isolation region 140 as an electrostatic protective circuit of this transistor 110, and first and second N-type diffused regions 114 and 150 are formed in the substrate 100. A pad 170 is connected with the region 150 via a contact 152. A static charge which is injected in the substrate 100 via the pad 170 is chiefly discharged through a first discharge route 190, and a second discharge route 192 which goes via a silicide layer 130 little functions as a discharge route as the contact resistance value between the layer 130 and the region 114 is higher than the resistance value of the region 114.
申请公布号 JP2001345422(A) 申请公布日期 2001.12.14
申请号 JP20000163022 申请日期 2000.05.31
申请人 SEIKO EPSON CORP 发明人 OKAWA KAZUHIKO;SAIKI TAKAYUKI
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L27/02;H01L27/088;H01L29/78;(IPC1-7):H01L27/04;H01L21/823 主分类号 H01L27/04
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