发明名称 SEMICONDUCTOR-MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately measure temperature by a thermocouple. SOLUTION: In this semiconductor-manufacturing device, a wafer W is placed on a susceptor 4 that is provided in a reaction pipe 1, and is heated by upper and lower lamps 2 and 3 for carrying out a predetermined treatment, and at the same time temperature near the wafer W is measured by a thermocouple 20 where a temperature-sensing contact is provided near the susceptor 4. In this case, a light shielding cover 30 for shielding direct light from the lower lamp 3 is provided in the temperature-sensing contact of the thermocouple 20.
申请公布号 JP2001345269(A) 申请公布日期 2001.12.14
申请号 JP20000162251 申请日期 2000.05.31
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 OSUMI NAOTO;KAKIZAKI SATOSHI;SHIMADA SHINICHI
分类号 C23C16/48;H01L21/205;H01L21/22;H01L21/26;(IPC1-7):H01L21/205 主分类号 C23C16/48
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