发明名称 THIN FILM ELECTRONIC PART, ITS MANUFACTURING METHOD AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a thin film electronic part having high capacitance and insulating properties, its manufacturing method and a substrate. SOLUTION: A thin film element A possessed of electrodes 5 and 7 and an insulating layer 3 is provided on a support substrate 1 and covered with an insulating protective film 9 for the formation of a thin film electronic part, where a through-hole 11 in which an outer terminal electrically connected to the electrode 7 is formed is provided to the insulating protective film 9, and an annular protrusion 17 is provided to the insulating protective film 9 around the through-hole 11.
申请公布号 JP2001345233(A) 申请公布日期 2001.12.14
申请号 JP20000364769 申请日期 2000.11.30
申请人 KYOCERA CORP 发明人 NAGAKARI NAONORI
分类号 H01G4/33;(IPC1-7):H01G4/33 主分类号 H01G4/33
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