发明名称 SEMICONDUCTOR PRESSURE SENSOR
摘要 PROBLEM TO BE SOLVED: To improve quantity resistance to dirty, and to correctly detect a pressure under the consideration of economy. SOLUTION: A recessed part 3 is formed in a resin package 1, and a sensor chip 2 is mounted in the recessed part 3. A narrow opening 7 whose opening area is relatively small and a wide opening 8 whose opening area is relatively large are formed in two rows in the recessed part 3, and a first protecting member 9 is arranged in the narrow opening 7, and a second protecting member 10 is arranged in the wide opening 8. The first protecting member 9 is made of resin materials whose Young's modulus is relatively high or rubber materials, and formed so that the exposed part of an insert pin 4 in the recessed part 3 can be covered in a state that a diaphragm 2a of the sensor chip 2 is exposed. Also, the second protecting member 10 is made of gel-shaped substances whose Young's modulus is relative low, and formed so that the first protecting member 9 and the upper half of the sensor chip 2 can be covered.
申请公布号 JP2001343298(A) 申请公布日期 2001.12.14
申请号 JP20000167361 申请日期 2000.06.05
申请人 DENSO CORP 发明人 HORIBA KEIJI;KATOU YUKIHIRO
分类号 G01L9/04;G01L19/14;H01L29/84;(IPC1-7):G01L9/04 主分类号 G01L9/04
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