| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which allows a proper formation of solder bumps on solder pads. SOLUTION: Solder bumps 76A, 76B to be transferred are formed on a solder bump transfer plate 90 made of ceramics. Using an alignment mark 94 of the solder bump transfer plate 90 and an alignment mark 162 of a substrate 30, the solder bump transfer plate 90 and the substrate 30 are aligned with each other. Thereafter, the solder bumps 76A, 76B are transferred to solder pads 75a, 75b. Thus, solder bumps can be formed properly on the solder pads 75a, 75b.
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