| 摘要 |
PROBLEM TO BE SOLVED: To form a lead so that the flat part of the tip of an entire external lead 18 gathers within the same surface, even if warpage exists in a package body 17, in a metal die for forming an external lead 18 that is led from the side of the package body 17 of a semiconductor device. SOLUTION: A root 18a of the external lead 18 that is led from the package body 17 is arranged in a clearance 4 so that the root 18a is not restricted, the middle part of the external lead 18 and the tip 18b are restricted by a punch 1 and at the same time are bent back and forth for flatly forming the tip 18b.
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