| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for scribing on the surface of a wafer at a constant length and depth regardless of irregularities in order to cleave the wafer efficiently into individual chips with high accuracy and high yield. SOLUTION: The scribing apparatus 4 comprises a lower movable base 5 sliding on the mounting table 2 of a base 1 in the scribing direction, an upper movable base 6 disposed thereon to move up and down by a height adjusting distance corresponding to irregularities on the wafer surface, an arm 11 having a central part pivoted to the forward end of the upper movable base 6 through a pin 7, a rear part provided with a projecting pin 8 abutting against a plate cam 9 of the lower movable base 5 and a forward end part fixed with a scribing pin 10, and a laser focus displacement gauge 13 secured to the frame 12 of the upper movable base 6, at the forward end thereof, directly above the scribing pin 10 in order to measure the vertical distance to the surface of the wafer 41.
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