Leadless solder composition with a bismuth base and the addition of two other metal elements to provide solder for use on fragile substrates such as glass

摘要

A leadless solder has a composition comprising not more than 90% by weight of bismuth, not more than 9.9% by weight of a second metal element that may form a binary eutectic with the bismuth and between 0.1 and 3.0% by weight of a third metal element. An Independent claim is included for a leadless soldered article comprising a substrate with a conducting track on its surface and a leadless solder placed to be connected electrically and mechanically to the conducting track.