| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for an electroless plating which reduces an amount of a plating solution used, stabilizes the plating process, downsizes the apparatus, reduces the cost, and gives a uniform film thickness. SOLUTION: The method for the electroless plating on a surface to be plated comprises, holding a semiconductor substrate W with a surface to be plated upward on a substrate holding part 11, supplying the electroless plating solution into a weir member 31 which is provided in surroundings of the semiconductor substrate W, from a shower head 41 and storing it, and holding the substrate in a resting state during plating for a predetermined time.
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