发明名称 PHOTOSENSITIVE ELEMENT WITH BUILT-IN CIRCUIT
摘要 PROBLEM TO BE SOLVED: To realize high photosensitivity, rapid processing and low consumption current, and prevent lowering of S/N. SOLUTION: A photodiode 27 where a photosensitive layer 17a is constituted of an SiGe layer and a bipolar transistor 28 as a signal processing circuit of the photodiode 27 are provided on an SOI substrate 29. A base layer 17b of the bipolar transistor 28 is also constituted of an SiGe layer.
申请公布号 JP2001345436(A) 申请公布日期 2001.12.14
申请号 JP20000161260 申请日期 2000.05.30
申请人 SHARP CORP 发明人 KUBO MASARU;FUKUSHIMA TOSHIHIKO;TANI YOSHIHEI
分类号 H01L27/14;H01L21/8222;H01L27/06;H01L27/144;H01L29/165;H01L31/10;(IPC1-7):H01L27/14;H01L21/822 主分类号 H01L27/14
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