SPHERICAL SEMICONDUCTOR, PACKAGING BOARD THEREOF, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve the problems in conventional technology for mounting parts on a board using a surface tension such as limitations to increasing mounting density and reducing the thickness, size and weight, and reliability in connection after mounting which is caused by contact holes for connecting a conductive layer for connecting the parts to a bottom surface and a conductive layer on the surface of the board. SOLUTION: Trenches are formed at the portions of a board where parts are mounted and the parts are self-aligned with and mounted on the board by surface tension to reduce the thickness, size and weight of a mounted board. Further, this method eliminates the need for forming a contact hole for connecting a conductive layer for connecting the parts to the bottom surface and the conductive layer on the surface of the board, and thus improves reliability in connection after mounting.