| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a connection structure and a pin arrangement by which resin sealing and packaging can be conducted at a pitch of 250μm or less as well as 250μm or more in an area arrangement. SOLUTION: Assuming that when connection portions of an area arrangement are cut at a cross section passing the center of the connection portions, the cross-sectional area of one connection portion is S1, the cross-sectional area of the gap between neighboring connection portions is S2, the number of longitudinal connection portions is N1, and the number of lateral connection portions is N2, even if S1 is equal to or larger than S2, N2/N1 is made equal to or larger than S1/S2, and the gaps between the connection portions are filled with resin from the side of the lateral connection portions.</p> |
