| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of forming a thin-film resistor in a printed board in which the thin-film resistor, in which size and thickness are controlled with high accuracy, can be formed. SOLUTION: The method of forming the thin-film resistor element 10 in the printed board 12 has a thin-film resistance-layer forming process, in which a thin-film resistance layer 26 having fixed thickness is formed by a dry process used for a semiconductor process or the like on an insulating layer 14 on the printed board, a conductive-layer forming process, in which a conductive layer 28 is formed onto the thin-film resistance layer, and a thin-film resistor forming process, in which the thin-film resistor 16 having a fixed resistance value is formed between at least two conductive-layer pads 18 by forming the conductive- layer pads by selectively etching the conductive layer. Accordingly, the thin-film resistor, in which size and thickness are controlled with high accuracy, can be formed. The upper and lower electrode layers are formed by interposing a dielectric layer on the inside by using the same technique, and a thin-film capacitor can also be formed.</p> |
