发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To surely attach a diffusion plate (or a background plate) to an attaching head. SOLUTION: A light, emitted to an electronic component from a recognizing device, is reflected on an attaching head 8 for holding an electronic part. The diffusion plate 60 (or the background plate, on which no light emitted to the electronic part from the recognizing device is made to reflect) for emitting light from behind the electronic component, is fitted to the attaching head 8 using a leaf spring 63 as an engagement assisting member.
申请公布号 JP2001345598(A) 申请公布日期 2001.12.14
申请号 JP20000162656 申请日期 2000.05.31
申请人 SANYO ELECTRIC CO LTD;SANYO HIGH TECHNOLOGY CO LTD 发明人 KANO YOSHINORI;USUI KATSUNAO
分类号 G01B11/00;H05K13/04;H05K13/08 主分类号 G01B11/00
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