发明名称 SOLID STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To manufacture a compact, general use, low-cost solid stage image pickup device a suitable to both mass production and many-kind small-lot production system which allows the spatial distance between the light transmitting plate inside and the light receiving surface of the image pickup device to be set as desired according to the shape of a mounting apparatus. SOLUTION: Leads 12 supplied from a TAB film are connected to a solid state image pickup element 11. A flange 14a of a package 14 shaped like a frame for housing the image pickup element 11 is inserted between the image pickup element 11 and an optical glass 13 facing a light receiving surface 11a of the element 11 and bonded thereto.</p>
申请公布号 JP2001345392(A) 申请公布日期 2001.12.14
申请号 JP20010093167 申请日期 2001.03.28
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUZUKI TAKANAO;HARAZONO BUNICHI;UCHIDA TAMOTSU
分类号 H01L27/14;H01L23/02;H04N5/335;H04N5/372;(IPC1-7):H01L23/02 主分类号 H01L27/14
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