发明名称 |
Lead frame and semiconductor device using the lead frame and method of manufacturing the same |
摘要 |
A semiconductor device includes a substrate, a semiconductor chip mounted on one surface of the substrate, wherein the semiconductor chip has an integrated circuit and bonding pads formed on a main surface thereof. The main surface of the semiconductor chip has a quadrilateral shape with the bonding pads being disposed along four sides of the main surface. A plurality of conductors is disposed on the one surface of the substrate so as to surround the semiconductor chip along four sides thereof and a plurality of bonding wires electrically connect the bonding pads with tips of the conductors, respectively. A resin body seals the semiconductor chip, the conductors and the plurality of bonding wires. A pitch between adjacent bonding pads increases in a direction toward four corners defined by the four sides of the main surface of the semiconductor chip.
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申请公布号 |
US2001050419(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
US20010904839 |
申请日期 |
2001.07.16 |
申请人 |
TANAKA SHIGEKI;FUJISAWA ATSUSHI;NAGANO SOUICHI;HIRANO TSUGIHIKO;OOTA RYOUICHI;KONNO TAKAFUMI;TATEBE KENICHI;OKAMOTO TOSHIAKI |
发明人 |
TANAKA SHIGEKI;FUJISAWA ATSUSHI;NAGANO SOUICHI;HIRANO TSUGIHIKO;OOTA RYOUICHI;KONNO TAKAFUMI;TATEBE KENICHI;OKAMOTO TOSHIAKI |
分类号 |
H01L23/433;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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