发明名称 |
DIFFERENTIAL PROCESS CONTROL METHOD |
摘要 |
A system and method for monitoring a process flow of a semiconductor wafer. In one embodiment, the method initially calculates a first location of the wafer before it is processed. The wafer is then moved into a process chamber where it is processed. Then a second location of the wafer is calculated before the wafer is unloaded. If the difference between the first and second locations are within a predetermined amount, the wafer is unloaded and regular processing steps proceed. If the difference is not within the predetermined amount, an alarm is activated and the process is stopped.
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申请公布号 |
US2001051839(A1) |
申请公布日期 |
2001.12.13 |
申请号 |
US19980137031 |
申请日期 |
1998.08.20 |
申请人 |
KENNY DANNY;LINDBERG KEITH |
发明人 |
KENNY DANNY;LINDBERG KEITH |
分类号 |
H01L21/00;(IPC1-7):G06F19/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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